Xiaomi 18 Fold with XRING O3 chip showcased at IFA 2026, we go eyes on

Xiaomi is set to launch its 18 Fold next week, and we got to check it out at IFA 2026 ahead of its unveiling. Spoiler alert: the device was placed behind glass, so we could not actually get our hands on it, but we did get to marvel at its design, and the first thing that struck us was that bright red color.

It certainly pops and is a lot more vibrant in person than some of the earlier shots we saw online.

Moving on to the actual design, the 18 Fold adopts the short and wide “passport” look, which made headlines with the Samsung Galaxy Z Fold8, and we certainly dig this form factor.

Unlike the Z Fold8, the Xiaomi 18 Fold features more rounded corners, which seems like a great ergonomic approach by Xiaomi. We expect that it won’t dig into your palms when you use it for longer periods of time.

As a result of the rounded corners, the 5.38-inch cover screen gets a slightly weird look, with the left side featuring a more squared-off look than the right side.

The display bezels look slim enough, and we could not manage to make out the crease on the main 7.58-inch panel under most angles. Again, we did not get to touch the unit, so we’ll have to make our judgments once we actually get to hold one in hand. The main display features a punch-hole cutout in the top right corner for the selfie cam.

Speaking of cameras, you get a second front-facing shooter on the cover screen and three cameras on the back housed in a visor. We’re expecting to find a main, telephoto and ultrawide formation.

Xiaomi has already confirmed that the 18 Fold will be equipped with its in-house Xring O3 chipset, which shows promising performance. And that’s all we have to share at this moment in time.

For more details, we’ll check in after the official unveiling next week.