Xiaomi 18 Fold is officially coming in September with the monstrous Xring O3 chipset

The next foldable smartphone from Xiaomi is not going to be called Xiaomi Mix Fold 5, but Xiaomi 18 Fold. The company has officially confirmed this. The device is going to be unveiled in September. It will be the first to use Xiaomi's new Xring O3 chipset, the successor to the Xring O1 from last year.

The Xring O3 managed to score 5,228,014 points in the AnTuTu V11 benchmark. That's more than any other smartphone SoC today.

The SoC features a deca-core CPU with two C1-Ultra cores clocked at up to 4.35GHz, four C1-Premium cores clocked at up to 3.68GHz, and four C1-Pro cores clocked at up to 3.15GHz.

In Geekbench 6.5, it manages a 3,945 single-core score and a 15,221 multi-core score. The Apple A19 Pro still does better in single-core, but is nowhere near the Xring O3 in multi-core.

In select benchmarks, the GPU has managed to be 85%, 94%, and 182% better than the Xring O1's, respectively. It also beats the Apple A19 Pro in all three tests that Xiaomi has shared (you can see them below). The Xring O3 supports LPDDR6 RAM with 113.8GB/s bandwidth.

All in all, it seems like Xiaomi's self-developed chipset has really grown up and will be a serious competitor to the best that Qualcomm, MediaTek, and Apple have to offer.

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