MediaTek Dimensity 9300 announced with big-core only CPU, boosted GPU with ray-tracing

The latest flagship chipset from MediaTek is here with the Dimensity 9300 and it aims to go head to head with Qualcomm’s Snapdragon 8 Gen 3 powering the incoming crop of Android flagships from Chinese smartphone makers.

Dimensity 9300 brings an all-big core CPU design

Dimensity 9300 is built on TSMC’s third-generation 4nm+ process node and its standout feature is the all-big core CPU design. You get a prime Cotex-X4 core clocked at 3.25GHz alongside 3x Cortex-X4 cores @ 2.85GHz and 4x Cortex-A720 cores @ 2.0GHz all based on the Armv9 architecture. MediaTek claims Dimensity 9300 offers a 40% improvement in peak performance compared to last year’s Dimensity 9200 while using 33% less power.

The CPU is joined by a 12-core Immortalis-G720 GPU with hardware-based ray tracing, offering a 46% improvement over its predecessor while drawing 40% less power. Dimensity 9300 also supports the latest LPDDR5T RAM @ 9,600Mbps speeds and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.

AI tasks are handled by the APU 790 which supports Generative AI with Stable Defusion generation in less than 1 second and support for LLM with up to 33 billion parameters. Dimesnity 9300 brings support for screens with up to WQHD resolution and 180Hz refresh rates as well as dual-active displays for foldables.

Image capture is handled by the Imagiq 990 ISP with always-on HDR as well as a standalone image stabilization module. The ISP can handle up to 8K video at 30 fps or 4K at 30/60 fps with cinematic mode and real-time bokeh. The R16 5G modem supports 4CC-CA Sub-6GHz and 8CC-CA mmWave bands. The modem should deliver improved power efficiency thanks to the MediaTek UltraSave 3.0+ technology.

Dimensity 9300 product brief

The vivo X100 series which launches tomorrow in China is expected to debut the new Dimensity 9300 platform. We’ll likely see more Android makers pledge their allegiance to the new chip in the coming days.

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